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Journal of Electronic Packaging
Purpose and Scope:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
SCOPE
Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
SCOPE
Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
Editor-in-Chief:
Shi-Wei Ricky Lee, The Hong Kong University of Science and Technology
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