Purpose and Scope:

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

SCOPE
Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems

Editor-in-Chief:

Shi-Wei Ricky Lee, Hong Kong University of Science & Technology

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2020 Reviewers of the year

Diversity and Inclusion
The Technical Committee on Publications and Communications endorses the commitment of ASME to support diversity and to create and ensure inclusive and ethical practices for publishing as well as the science and engineering professions.