Applied Mechanics Reviews ASCE-ASME Journal of Risk and Uncertainty in Engineering Systems, Part B: Mechanical Engineering Applied Mechanics Biomechanical Engineering Computational and Nonlinear Dynamics Computing and Information Science in Engineering Dynamic Systems, Measurement and Control Electrochemical Energy Conversion and Storage Electronic PackagingEnergy Resources Technology Engineering for Gas Turbines and Power Engineering Materials and Technology Fluids Engineering Heat Transfer Manufacturing Science and Engineering Mechanical Design Mechanisms and Robotics Medical Devices Micro- and Nano-Manufacturing Nuclear Engineering and Radiation Science Offshore Mechanics and Arctic Engineering Pressure Vessel Technology Solar Energy Engineering: Including Wind Energy and Building Energy Conservation Thermal Science and Engineering Applications Tribology Turbomachinery Verification, Validation and Uncertainty Quantification Vibration and Acoustics Fuel Cell Science and Technology Nanotechnology in Engineering and Medicine
Purpose and Scope:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems. Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems packaging are areas of growing interest for the Journal. Originality, scientific merit and high engineering relevance are the major criteria for the acceptance of a submitted paper.
Y.C. Lee, University of Colorado at Boulder