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Journal of
Applied Mechanics Reviews
Applied Mechanics
Biomechanical Engineering
Computational and Nonlinear Dynamics
Dynamic Systems, Measurement and Control
Electronic Packaging
Energy Resources Technology
Engineering for Gas Turbines and Power
Engineering Materials and Technology
Fluids Engineering
Fuel Cell Science and Technology
Heat Transfer
Manufacturing Science and Engineering
Mechanical Design
Mechanisms and Robotics
Medical Devices
Nanotechnology in Engineering and Medicine
Offshore Mechanics and Arctic Engineering
Pressure Vessel Technology
Solar Energy Engineering
Thermal Science and Engineering Applications
Tribology
Turbomachinery
Vibration and Acoustics
Computing and Information Science in Engineering

Journal of Electronic Packaging
(ISSN 1043-7398) 

EDITOR
B. SAMMAKIA (2013)

ASSISTANT TO THE EDITOR
G. MILLER

ASSOCIATE EDITORS
D. AGONAFER (2010)
C. BASARAN (2010)
B. COURTOIS (2010)
B. HAN (2010)
A.Y.-H. HUNG (2010)
K. KISHIMOTO (2010)
P. LALL (2010)
G. LORENZINI (2009)
G.-Q. LU (2010)
S. MCKEOWN (2010)
J.H.L. PANG (2010)
J. QU (2010)
K. RAMAKRISHNA (2010)
G. REFAI-AHMED (2010)
S. TONAPI (2009)

PUBLICATIONS COMMITTEE
Chair, B. RAVANI

OFFICERS OF THE ASME
President, A.E. HOLT
Executive Director, T.G. LOUGHLIN
Treasurer, W. MARNER

PUBLISHING STAFF
Managing Director, Publishing
P. DI VIETRO
Manager, Journals
C. MCATEER
Production Coordinator
A. HEWITT
The ASME Journal of Electronic Packaging is published quarterly (March, June, September, December) by ASME, Three Park Avenue, New York, NY 10016-5990.

This journal is sponsored and supported by the ASME Electronic and Photonic Packaging Division.

POSTMASTER:
Periodicals postage paid at New York, NY and additional mailing offices.

Send address changes to: ASME Journal of Electronic Packaging
c/o ASME International
22 Law Drive, Box 2300
Fairfield, NJ 07007-2300

Change of address must be received at the above address seven (7) weeks before they are to be effective.

Statement from By-Laws
The Society shall not be responsible for statements or opinions advanced in papers or . . . printed in its publications (B7.1, Para. 3)

Copyright 2009 by ASME
For authorization to photocopy material for internal or personal use under those circumstances not falling within the Fair Use provisions of the Copyright Act, complete and submit a permissions request form.

Requests for reprints should be addressed to Marisol Andino, andinom@asme.org.

Abstract and Indexing Information
Current List

Tax Registration: #126148048

Contact the Editor:

Bahgat Sammakia
Prof. of Mechanical Engineering
Director of the IEEC
Watson School of Engineering
State University of New York at Binghamton
Binghamton, NY 13902
P: 607-777-6880
F: 607-777-4683
Bahgat@binghamton.edu



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