| EDITOR
B. SAMMAKIA (2013)
ASSISTANT
TO THE EDITOR
G. MILLER
ASSOCIATE
EDITORS
D. AGONAFER (2010)
C. BASARAN (2010)
B. COURTOIS (2010)
B. HAN (2010)
A.Y.-H. HUNG (2010)
K. KISHIMOTO (2010)
P. LALL (2010)
G. LORENZINI (2009)
G.-Q. LU (2010)
S. MCKEOWN (2010)
J.H.L. PANG (2010)
J. QU (2010)
K. RAMAKRISHNA (2010)
G. REFAI-AHMED (2010)
S. TONAPI (2009)
PUBLICATIONS COMMITTEE
Chair, B. RAVANI
OFFICERS
OF THE ASME
President, A.E. HOLT
Executive Director, T.G. LOUGHLIN
Treasurer, W. MARNER
PUBLISHING
STAFF
Managing Director, Publishing
P. DI VIETRO
Manager, Journals
C. MCATEER
Production Coordinator
A. HEWITT
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The ASME Journal of Electronic Packaging is published
quarterly (March, June, September, December) by ASME, Three Park Avenue,
New York, NY 10016-5990. This journal is sponsored and supported by the ASME Electronic and Photonic Packaging Division.
POSTMASTER:
Periodicals postage paid at New York, NY and additional mailing offices.
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address changes to: |
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Journal of Electronic Packaging
c/o ASME International
22 Law Drive, Box 2300
Fairfield, NJ 07007-2300 |
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they are to be effective.
Statement
from By-Laws
The Society shall not be responsible for statements or opinions advanced in
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Copyright 2009 by ASME
For authorization to photocopy material for internal or personal use under
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Act, complete and submit a permissions request form.
Requests
for reprints should be addressed to Marisol Andino, andinom@asme.org.
Abstract and Indexing Information
Current List
Tax
Registration: #126148048
| Contact
the Editor: |
Bahgat Sammakia
Prof. of Mechanical Engineering
Director of the IEEC
Watson School of Engineering
State University of New York at Binghamton
Binghamton, NY 13902
P: 607-777-6880
F: 607-777-4683
Bahgat@binghamton.edu
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